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AFRL Develops Better Way to Cool Electronics

Researchers at the Air Force Research Laboratory and a partner company have developed a way to cool the next generation of high-powered electronics —increasing capabilities of warfighters — with simple materials. Thermal management via oscillating heat pipes are expected to enter commercial systems within the next few years. Companies such as Boeing are interested in

Engineered “Sand” May Help Cool Electronic Devices

Baratunde Cola would like to put sand into your computer. Not beach sand, but silicon dioxide nanoparticles coated with a high dielectric constant polymer to inexpensively provide improved cooling for increasingly power-hungry electronic devices. The silicon dioxide doesn”t do the cooling itself. Instead, the unique surface properties of the coated nanoscale material conduct the heat

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