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AFRL Develops Better Way to Cool Electronics

Researchers at the Air Force Research Laboratory and a partner company have developed a way to cool the next generation of high-powered electronics —increasing capabilities of warfighters — with simple materials. Thermal management via oscillating heat pipes are expected to enter commercial systems within the next few years. Companies such as Boeing are interested in

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Engineered “Sand” May Help Cool Electronic Devices

Baratunde Cola would like to put sand into your computer. Not beach sand, but silicon dioxide nanoparticles coated with a high dielectric constant polymer to inexpensively provide improved cooling for increasingly power-hungry electronic devices. The silicon dioxide doesn”t do the cooling itself. Instead, the unique surface properties of the coated nanoscale material conduct the heat

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