Microscopes for Measuring Bondline Thicknesses

DSIAC was asked to research what types of microscopes were best for measuring bondline thicknesses caused by the adhesive bonding of metal and composite samples. The microscope would need to be able to make measurements in the range of 1-1000 microns and desired components included an electronically and manually moving stage, a dual eyepiece, and a camera allowing measurements on a screen. DSIAC staff then did DTIC and open source searches to determine what technologies have been used to make such measurements and contacted original equipment manufacturers (OEMs) to determine the best setups from each manufacturer for the requested purpose. A report was created and delivered to the inquirer with the combined bibliographies and detailed technological and contact information for the various microscopes.